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Using Existing Reconfigurable Logic in 3D Die Stacks for Test
Conference proceeding

Using Existing Reconfigurable Logic in 3D Die Stacks for Test

Fanchen Zhang, Yi Sun, Xi Shen, Kundan Nepal, Jennifer Dworak, Theodore Manikas, Ping Gui, R Iris Bahar, Al Crouch and John Potter
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Conference Proceedings, p.46
01/01/2016

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